Several companies are developing or ramping up panel-level fan-out packaging as a way to reduce the cost of advanced packaging. Fan-out packaging on a large square panel is significantly more ...

An insatiable demand for logic to memory integration for AI and high-performance computing is driving progress toward very large-format packages, which are expected to approach 10 times the maximum ...

Korean semiconductor packager Nepes has become the world's first to commercialize fan-out panel level package (FO-PLP) technology. It will allow smartphone makers to reduce costs spent on chips, which ...

TSMC is exploring a 'radically new' method of semiconductor chip packaging, as the world of AI is simply not slowing down and needs further advancements at every level to keep up. TSMC Is reportedly ...

Breakthrough yield and device performance at high volume show team can scale company's large-format advanced packaging for customers' cutting-edge applications SINGAPORE, Oct. 15, 2025 /PRNewswire/ -- ...

Semes, a semiconductor equipment company, said on the 16th that it has developed for mass production, for the first time in Korea, the TEPAS100, a sorter for large semiconductor panel-level package ...