X-Fab Semiconductor Foundries today announced it has expanded its product line, entering the silicon on insulator (SOI) wafer processing arena. The Erfurt, Germany-based mixed-signal foundry has ...

The 300mm silicon carbide wafer targets higher production capacity for power electronics and advanced system integration.

Cerebras Systems and the federal Department of Energy’s National Energy Technology Laboratory today announced that the company’s CS-1 system is more than 10,000 times faster than a graphics processing ...

Modern semiconductor fabrication involves aligning silicon wafers and photolithography masks to nanometre precision. As the industry shifts from using 200 mm diameter wafers to 300 mm wafers, ...

In an update to its International Technology Roadmap for Photovoltaics, German engineering association the VDMA notes standardization of wafer size is a topic of great interest to the country’s PV ...

Power consumption is a crucial consideration for all types of electronics. As critical power components used in a wide range of electronic products, power MOSFET and other types of power semiconductor ...

SANTA CLARA, Calif., March 16, 2021 (GLOBE NEWSWIRE) -- Applied Materials, Inc. today unveiled a major innovation in process control that uses Big Data and AI technology to help semiconductor ...

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Detecting macro-defects early in the wafer processing flow is vital for yield and process improvement, and it is driving innovations in both inspection techniques and wafer test map analysis. At the ...

The global market for DRAM Wafer was valued at USD 12360 Million in the year 2024 and is projected to reach a revised size of USD 18560 Million by 2031, growing at a CAGR of 6.0% during the forecast ...

Taiwan-based Phoenix Silicon International (PSI), dedicated to wafer reclaim, wafer thinning and MEMS mid-end process services, plans to set up a new plant to fulfill robust orders from international ...

Schmid develops new multi wafer texturing process The German production manufacturer has announced the development of a new process for the texturing of diamond wire cut multi silicon wafers. Schmid ...