Modern-day high-volume semiconductor manufacturing is a complex process that spans numerous stages and nodes. And with the ever increased focus on quality and cost, the manufacturing supply chain is ...

Detecting macro-defects early in the wafer processing flow is vital for yield and process improvement, and it is driving innovations in both inspection techniques and wafer test map analysis. At the ...

Partially defective, marginal die can still be functional enough to pass final electrical test. Some of these “walking wounded” chips get past final testing, but in the customer’s end product, under ...

Known-good-die (KGD) sort is a commonly used technique in semiconductor processing that allows IC device engineers to bypass the packaging of defective semiconductor devices, saving time and money.

Numerous challenges have to be overcome during design and production of ICs below 90 nm. Manufacturing processes are still being characterized, and the interactions between the physical processes and ...

At the beginning of any chip design, engineers rarely discuss reliability and operation at the extremes of the device's temperature range. If parts have not been properly characterized, failures can ...