The small and complicated features of TSVs give rise to different defect types. Defects can form during any of the TSV ...
The steady march toward 3D ICs, namely mixed-signal or multi-technology systems-on-chip (SoC) or systems-in-package (SiP), is becoming a brisk jog. With a mix of military and government funding, and ...
Among the challenges of a widespread adoption of 3D ICs is how to test them, particularly when it comes to through-silicon vias (TSVs). While not necessarily presenting a roadblock, TSVs use in the ...
The looming transistor scaling limits have driven the semiconductor industry to advance packaging in order to stay in line with Moore's Law. TSVs facilitate advanced semiconductor packaging by ...
Fig 1. The system-in-package approach is part of the trend toward thinner and more integrated 3D IC packages for CPUs, GPUs, and FPGAs for use in camera modules and wireless products, where high ...
Globalfoundries has demonstrated its first fully functional SRAM wafers that use TSVs on its 20nm-LPM (low power for mobile) process. TSVs enable 3D stacking of chips, which not only reduces physical ...
Toshiba has used through silicon vias (TSVs) to connect up to 16 stacked die in a range NAND flash chips. The prototype will be shown at Flash Memory Summit in Santa Clara next week. “Prior art ...
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