RF SiP technology is an enabling packaging platform for wireless communication, which is constrained by the fact that, today, SiP design is an “expert engineering” process—one that is not scalable as ...

There are two approaches to reduce component count when a wireless system is developed: System-In-Package (SiP) and System-On-Chip (SoC). Both solutions provide interesting tradeoffs at the silicon ...

The advanced packaging market for 5G RF Front End Module (FEM) projected to reach US $2.3B by 2026 Amkor continues to innovate in advanced SiP technologies TEMPE, Ariz.--(BUSINESS WIRE)--Amkor ...

Thanks to advances in circuit miniaturization and systemin- package (SiP) technology, the goals of smaller size and more functionality have become attainable. Thanks to advances in circuit ...

Giga Solution, a test service corporation focusing on RFIC/SiP/SoC test area, and Global Unichip, a fabless ASIC and SoC design service provider, have announced the jointly developed test service ...

The IoT represents a rapidly growing market for which high-speed wireless connections suitable for various usage systems are indispensable. The arrival of digital transportation is accelerating this ...

The RFS1080 RF SiP is a high-frequency, direct-to-digital transceiver solution designed and manufactured in a trusted, DMEA-accredited facility that successfully scales computing density while ...

US-based Master Electronics has added RF modules to its offering with the signing of French RF module specialist, Insight SIP. The distributor is based in Phoenix, Arizona but ships worldwide as ...

TEMPE, Ariz.--(BUSINESS WIRE)--Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of outsourced semiconductor assembly and test (OSAT) services, is advancing the evolution of 5G RF module ...

Hsinchu, Taiwan -- Mar. 23, 2009-- Giga Solution Tech. (TW:3559), the only professional test service corporation focusing on RFIC/SiP/SoC test area, and Global Unichip Corp. (GUC; TW:3443), the ...