CHANDLER, Ariz., Dec. 06, 2023 (GLOBE NEWSWIRE) -- The E-Mobility, sustainability and data center markets require products that are conducive to high-volume ...
Offered in both silicon and silicon carbide versions, Microchip’s SP1F and SP3F power modules now come with press-fit terminals for high-volume applications. Press-fit terminals enable solder-free PCB ...
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