Fraunhofer Institute for Reliability and Microintegration IZM has provided an update on a consortium that is developing panel-level IC packaging technologies. Fraunhofer IZM is leading the consortium.

Packaging houses continue to ramp up fan-out wafer-level packages in the market, but customers want lower cost fan-out products for a broader range of applications, such as consumer, RF and ...

DRESDEN, Germany--(BUSINESS WIRE)--Did you ever open a freshly-bought cereal or bag of potato-chips that was not fresh at all? Did it taste sticky and rubber-like? To prevent unpleasant surprises like ...