QPT just filed a patent for the “qAttach” process, a novel way to attach dies to heat spreaders or substrates (typically aluminum nitride (AlN)) that significantly reduces thermal resistance. The new ...
As a provider of advanced materials solutions for power device packaging, Indium Corporation will feature its lineup of high-reliability products at APEC 2026, March 22 to March 26, in San Antonio, ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results